This is a filled, medium purpose potting and encapsulating resin and hardener with excellent bonding properties, good air release and a high gloss finish. Underwriters Laboratories (UL) approved at 94 HB. Ideal for transformers, circuit boards, magnetic components, and noise filters.
AC-VFR/H TS100 resin and hardener
AC-VFR/H TS100 is a filled, low viscosity, high temperature potting and encapsulating resin and hardener. Underwriters Laboratories® (UL) approved at 94 VO.
This is an unfilled, low viscosity resin with high strength adhesion and good air release. It is ideal for the most intricate applications, such as circuit boards.
AC-760 is a filled, medium viscosity, high temperature potting and encapsulating resin. It features excellent impact resistance, thermal shock resistance, thermal conductivity and a high deflection temperature. Ideal for control units, transformers, noise filters, and similar components.